Institutional development · Leadership and governance · India
IIT Bombay Institute Lecture features UCLA CHIPS director on the future of chip packaging
The Indian Institute of Technology Bombay is organising an Institute Lecture by Prof. Subramanian S. Iyer of UCLA on the next phase of advanced electronics packaging.
Why it matters: The lecture IIT Bombay is organising will set out a UCLA chip-packaging director's view of the technological options for scale-down and scale-out.
The Indian Institute of Technology Bombay said it is organising an Institute Lecture titled 'What is next in “Advanced” Packaging'.
According to the institute, the speaker is Prof. Subramanian S. Iyer, Director of UCLA CHIPS and a Distinguished Professor in electrical and computer engineering and in materials science and engineering at the University of California, Los Angeles.
The lecture abstract states that silicon interposers and 3D memory stacking are now mainstream but remain complex and costly, which it says limits wider adoption.
The abstract says the next shift in packaging rests on two pillars: scale-down, which shrinks package features, and scale-out, which enlarges the effective package to hold more active silicon.
Editor’s view
Abigail Taylor, Leadership and Governance Editor
According to the abstract, Prof. Iyer will use the IIT Bombay lecture to present the technological options required to achieve scale-down and scale-out in electronics packaging.
